News Releases

Jan.18, 2012

Realizing the smallest and thinnest size (*1) in the industry Announcing the release of the “SAW device” Suitable for miniaturization as well as modularization of RF signal-processing circuits used in mobile devices, such as smart phones and tablet PCs

(*1) Our investigation of the SAW device (mass-production type) as of January 18, 2012

New Product

Product name	SAW device
	SAW duplexer	SAW single filter SAW dual filter
Series name	EFSDP(L) series	EFCHT series
Production start	January, 2012
Sample price	To be confirmed individually (depending on specifications and quantities)
Production capacity	2 million pieces/month

Industrial Devices Company, Panasonic Corporation has been mass-producing SAW devices (SAW duplexer, SAW filter) which are made using chip-size-package-process (CSP), and are used for RF signal-processing circuits of mobile devices, such as smart phones and mobile phones. To answer the market requirements for the smaller and thinner RF signal-processing circuits, we have newly developed our original wafer-level-chip-size-package (WLCSP) which is more in advance of CSP process, and have commercialized the industry' s thinnest SAW device. We will supply newly developed SAW devices to the mobile-peripheral market such as smart phones.

Features

1. Industry' s mallest and thinnest, contributing to downsizing and thinning the unit

SAW duplexer : L 1.8 mm × W 1.4 mm × H 0.35 mm approx. 65 % reduction compared with our current models

SAW dual filter : L 1.1mm × W 0.9 mm × H 0.35 mm approx. 80 % reduction compared with our current models

SAW single filter : L 0.8 mm × W 0.6 mm × H 0.35 mm approx. 80 % reduction compared with our current models

Volume: approx. from 65 to 80 % reduction compared with our current models (*2)

2. Low insertion loss and high attenuation properties (steepness), increasing receiver sensitivity

SAW duplexer, in compliance with standard UMTS Band 5

• [Tx(Transmitter)] Insertion loss : 2.0 dB max. (typ. 1.6 dB, Isolation):55 dB min. (typ.72 dB)
• [Rx(Receiver)] Insertion loss : 3.2 dB max. (typ. 1.6 dB, Isolation):50 dB min. (typ.58 dB)

3. Excellent mouldability, available to install in various modules

Resin seal-pressure : 9 MPa

• (*2) Our current modules : SAW devices (EFSDK series, EFCHT/P series)

Applications

RF signal-processing circuits of smart phones, tablet PCs, mobile phones etc.