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Global Home Automotive & Industrial Systems Company > Automotive & Industrial Systems Company - Industrial Devices > News Releases > Announcing the release of halogen-free and low dielectric-constant Multi-layer material

News Releases

June.1, 2012

Realizing low dielectric-constant and excellent heat-resistance highest in the industry (※1) Announcing the release of halogen-free and low dielectric-constant Multi-layer material Supporting for impedance-matching of Multi-layer PCB used in high-performance mobile peripherals such as smart-phones

  • (※1) Our investigation of halogen-free Multi-layer materials for used in high-performance mobile-peripherals as of May 31, 2012

May 31, 2012, Osaka, Japan-Industrial Devices Company, Panasonic Corporation has developed the halogen-free, low dielectric-constant materials highest in the industry(※1) , which are suitable for Multi-layer PCB used in high-performance mobile peripherals, such as smart-phones and tablet PCs.

Product name Halogen-free, low dielectric-constant
Multi-layer material
Model number R-1555 S
Production start September 2012
UL/ANSI Grade FR-4
UL approved (flame-retardant) 94V-0 (acquired)

As high-performance mobile peripherals, such as smart-phones and tablet PCs, have become smaller, thinner, as well as more multi-functional, Multi-layer PCB to be built in a variety of devices has been required to be higher-density wiring, multi-layered, and thinner. To meet the market demand, Industrial Devices Company, Panasonic Corporation has succeeded in developing “ Halogen-free, low dielectric-constant Multi-layer material, R-1555 S“, achieving lowest dielectric-constant in the industry, which are supporting for impedance-matching at the circuit-design stage in built-up Multi-layer PCB .

Features

1. Lowest dielectric-constant in the industry (※1), supporting for impedance-matching of high-density wiring, high multi-layer, thin built-up Multi-layer PCB .
Dielectric-constant ratio (Dk) :3.6, approx. 15 % reduction compared with our conventional models (※2)
2. Higher heat-decomposition temperature, achieving excellent heat-resistance properties
Heat-composition temperature: 385 ℃, approx. 10 % improvement compared with our conventional models (※2)
3. Available for halogen-free and lead-free soldering process, contributing to keeping global environment
  • (※2) Our conventional models: Halogen-free multi-layer materials (Model number: R-1566 )

Applications

Main substrates used in high-performance mobile peripherals, such as smart phones and tablet PCs, etc.

Notes

We exhibited the newly developed materials at JPCA Show held in Tokyo Big Site (from June13 to 15, 2012).

The content in the following news releases is accurate at the time of publication but may be subject to change without notice.
Please note therefore that these documents may not always contain the most up-to-date information.

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