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Global Home Automotive & Industrial Systems Company > Automotive & Industrial Systems Company - Industrial Devices > News Releases > Announcing the release of flexible circuit board materials (resin coated copper foils) “FELIOS FRCC ™”

News Releases

June.12, 2012

Contributing to building up the flex-rigid circuit board more Multi‐layer and thinner Announcing the release of flexible circuit board materials (resin coated copper foils) “FELIOS FRCC ™(※1) Simplifying the treatment process at manufacturing the flex-rigid Circuit Board

  • (※1)“FELIOS FRCC” is Panasonic company’s trademark.

June 12, 2012, Osaka, Japan- Industrial Devices Company, Panasonic Corporation has succeeded in developing flexible circuit board materials (resin coated copper foil s) “FELIOS FRCC”, which are suitable for forming the circuit board for a variety of modules used in the high-performance mobile products such as, smart phones and tablet PCs, more Multi‐layer and thinner

Product name flexible circuit board materials (resin coated copper foil s) “FELIOS FRCC ™ ”
Product number R-MFES
Production start June 2012

As high-performance mobile products, such as smart-phones and tablet PCs, have become smaller, thinner, as well as more multi-functional, the substrate to be mounted on a variety of modules has been required to be thinner and higher cost-effective. To meet the market demand, Industrial Devices Company, Panasonic Corporation has succeeded in developing flexible circuit board materials (resin coated copper foils) “FELIOS FRCC”, which are contributing to forming circuit board thinner and to more simplifying the treatment process at manufacturing circuit board compared with the general flex-rigid circuit board.

Features

1. Achieving thinner circuit board , compared with the general flex-rigid circuit board
Board thickness : 0.2 mm possible in 4-layers circuit board
                          approx. 20 % reduction in thickness
2. Simplifying the treatment process at manufacturing circuit board.

Applications

Circuit board to be mounted on a variety of modules used in high-performance mobile products such as, smart phones and tablet PCs, etc.

Notes

We exhibited the newly developed materials at JPCA Show held in Tokyo Big Site (from June13 to 15, 2012).

The content in the following news releases is accurate at the time of publication but may be subject to change without notice.
Please note therefore that these documents may not always contain the most up-to-date information.

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Global Home Automotive & Industrial Systems Company > Automotive & Industrial Systems Company - Industrial Devices > News Releases > Announcing the release of flexible circuit board materials (resin coated copper foils) “FELIOS FRCC ™”