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March 12, 2013, Osaka, Japan－Industrial Devices Company , Panasonic Corporation has launched a CSP type Schottky Barrier Diode with key characteristics such as Ultra Small Packaging, High Power and High Heat Dissipation, and Higher Efficiency with less Voltage Loss, suitable for Power Circuits in Mobile applications.
|Product||Schottky Barrier Diode|
|Series||DB2G series||DB2L series||DB2M series|
|VR/VF||20 to 40V/1A||12 to 30V/0.5A||12 to 20V/0.2A|
|Package size||1.0 x 0.6 x 0.1mm||0.6 x 0.3 x 0.1mm||0.4 x 0.2 x 0.1mm|
|MP schedule||Jun., 2013||Aug., 2013||Oct., 2013|
|Sample price||Please contact your local sales office|
|MP capacity||Over 3Mpcs/month|
As Mobile applications, such as Smart Phones, continue to go smaller, thinner and lighter, board sizes also have the same size limitations, resulting in extremely dense circuit designs. Therefore, downsizing all components are a must and thermal management has become an even more important factor in board designs. Also, despite the limited space, the power supply circuit has even more loads with constantly growing data-communications and High-end High-tech functions. To solve these issues, Panasonic is announcing a new CSP Diode series, with features such as Ultra-small packaging. (0.6mm x 0.3mm), Industry top-level Low Forward Voltage (15% reduction), and Industry top-level thermal performance (33% heat reduction) . This series has a line-up of 16 parts to fit all customer designs and requirements.
|<Package size>||SMT area||:||0.18mm2||86% reduction (*2)|
|Height||:||0.10mm||83% reduction (*2)|
|Volume||:||0.018mm3||98% reduction (*2)|
|<VF characteristic>||:||0.39V（0.5A Typ）||15% reduction (*2)|
|<Heat Dissipation>||Junction temp||:||80.9 ℃ 33% reduction (*2)|
Power circuits for mobile applications such as Smart Phones, Tablets
The content in the following news releases is accurate at the time of publication but may be subject to change without notice.
Please note therefore that these documents may not always contain the most up-to-date information.
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