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PCB and Packaging Technology for Creating a New Future for People and the Earth
- Development of a short lead-time through the integrated/coordinated design of chips and boards.
- Optimum package design through thermal, electrical, structural analyses performed upstream of the development work.
- Distinctive performance packages for individual uses
“Integrated/coordinated designing” realizes a first-response operation. for Chips / package / PCB / electricity / heat / structural design.
- A motherboard for high density mounting that is achieved by Panasonic original material, interconnection, fine patterning and PCB manufacturing technologies.
- Multi-layer film substrate and organic cavity substrate with any layer IVH, that support to next generation mounting such as thin or 3-D packaging.
- Integrated/coordinated design constructs the integrity (structural, thermal and electrical) and the hierarchy (chip design, package design and PCB design). This can achieve high-performance packaging in a short lead-time.
PCB and Packaging technology contributes to product sets with higher functionality and to rapid design, leading to the creation of a smart community.
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